Cooling system for a computer device

ABSTRACT

A cooling system for cooling a heat source includes: a base unit configured with a fluid containing passage therein; a heat-conductive fluid container mounted on a mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and a heat exchanging fluid contained in the fluid-receiving space in the fluid container and the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of Taiwanese Application No. 098210312, filed on Jun. 10, 2009.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a cooling system, and more particularly to a cooling system for a computer device.

2. Description of the Related Art

Referring to FIG. 1, a conventional water cooling mechanism 14 is shown to be applied to a computer device 10 that includes a computer housing 11, a motherboard 12 disposed in the computer housing 11 and mounted with a central processing unit (CPU) 121, a video card 13 and other chips (not shown) thereon. The conventional water cooling mechanism 14 includes a hollow heat dissipating body 143 attached directly to the CPU 121, a heat sink 141 disposed in the computer housing 11, a conduit unit 142 that is coupled between the heat-dissipating body 143 and the heat sink 141 and that contains water therein, and a fan 144 mounted on the heat sink 141. Heat generated by the CPU 121 can be transferred to the heat sink 141 through heat exchange with the water contained in the conduit unit 142, and the fan 144 is operable to cool the heat sink 141. Therefore, heat dissipation of the CPU 121 is attained.

However, due to the presence of the conduit unit 142, the assembly procedure of the conventional water cooling mechanism 14 is relatively complicated. Furthermore, when heat generated by the other chips is to be dissipated, additional conduits are required and occupy additional space in the computer housing 11. As a result, the conventional water cooling mechanism 14 is not suitable for a miniaturized computer device.

SUMMARY OF THE INVENTION

Therefore, the object of the present invention is to provide a cooling system that can provide a superior cooling effect and that can overcome the aforesaid drawbacks of the prior art.

According to the present invention, there is provided a cooling system for cooling a heat source. The cooling system comprises:

a base unit configured with a fluid containing passage therein and having a mounting side;

a heat-conductive fluid container mounted on the mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and

a heat exchanging fluid contained in the fluid-receiving space in the fluid container and in the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:

FIG. 1 is a perspective view showing a conventional water cooling mechanism applied to a computer device;

FIGS. 2 and 3 are perspective views showing a computer device provided with the preferred embodiment of a cooling system according to the present invention, wherein a cover plate is dispensed with in FIG. 2;

FIG. 4 is an exploded perspective view showing the preferred embodiment;

FIG. 5 is a schematic side view showing the preferred embodiment; and

FIG. 6 is a schematic side view showing a base body of the preferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIGS. 2 and 3, the preferred embodiment of a cooling system according to the present invention is shown to be applied to a computer device, such as a home computer, for cooling the computer device serving as a heat source. The computer device generally includes a motherboard mounted with a CPU, a plurality of memory cards, South-bridge chips and North-bridge chips thereon (not shown) and disposed in a housing. The cooling system includes a rectangular base unit 20, a heat-conductive fluid container 3, a heat exchanging fluid (not shown), two heat dissipating devices 4, 4′, and two driving units 5.

Referring further to FIGS. 4 to 6, the base unit 2 is configured with a fluid containing pas sage therein. In this embodiment, the base unit 2 can be a part of a housing of the computer device, and includes a rectangular base body 21 and a cover body 22. The base body 21 is made of a heat-conductive material, such as aluminum, and has a mounting side 211, and a connecting side 212 opposite to the mounting side 211 and formed with a groove unit 20 (see FIG. 4). The cover body 22 is attached on the connecting side 212 of the base body 21, and covers sealingly the groove unit 20 such that the groove unit 20 constitutes the fluid containing passage. The mounting side 211 of the base body 21 is formed with a plurality of openings 201˜206 in spatial communication with the fluid containing passage in the base unit 2, as shown in FIG. 6. In this embodiment, the base unit 2 is formed with first and second through holes 23, 24 extending from the mounting side 211 to the connecting side 212. The motherboard of the computer device is disposed in the first through hole 23, and is mounted to the base body 21 through a plate body 8 fixed on the connecting side 212 of the base body 21 and covering the first through hole 23 (see FIG. 3). In this embodiment, the base unit 2 has a thickness of about 3 cm, and is relatively small, thereby facilitating miniaturization of the computer device.

In this embodiment, the heat-conductive fluid container 3 is mounted on the mounting side 211 of the base body 21, and extends across the through hole 23 in the base unit 2. In addition, the heat-conductive fluid container 3 is made of copper, is adapted to be placed in contact with the CPU, the South-bridge chips and the North-bridge chips, and is formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit 2 via the openings 201, 202, as shown in FIG. 5.

The heat exchanging fluid, such as water, (not shown) is contained in the fluid-receiving space in the fluid container 3 and in the fluid containing passage in the base unit 2. The heat exchanging fluid is capable of changing into fluid vapor when absorbing heat generated by the heat source. The fluid vapor is capable of changing into fluid condensate when cooled.

As shown in FIG. 4, the heat sink device 4 includes two heat-conductive bodies 41, 42, a plurality of heat-dissipating fins 43, and a fan unit 44. In this embodiment, the heat-conductive bodies 41, 42 are mounted on the mounting side 211 of the base body 21 of the base unit 2, and are spaced apart from each other. Each of the heat-conductive bodies 41, 42 is formed with an inner receiving space 410, 420 in spatial communication with the fluid containing passage in the base unit 2 via a corresponding one of the openings 205, 206 in the base body 21 of the base unit 2 (see FIGS. 4 and 5) such that the inner receiving space 410, 420 in each of the heat-conductive bodies 41, 42 permits flow of the heat exchanging fluid thereinto. The heat-dissipating fins 43 interconnect the heat-conductive bodies 41, 42 and extend across the second through hole 24 in the base unit 2. The fan unit 44 is disposed between the heat-conductive bodies 41, 42, is exposed through the base body 21 via the second through hole 24, and is visible from the connecting side 212 of the base body 21 for cooling the dissipating fins 43, as shown in FIG. 3.

As shown in FIG. 2, the heat sink device 4′ is adapted for dissipating heat generated by the memory cards of the computer device in this embodiment. The heat sink device 4′ is mounted on the mounting side 211 of the base body 21 of the base unit 2, and includes two heat-conductive bodies 41′, 42′ spaced apart from each other, and a plurality of heat-dissipating fins 43′ interconnecting the heat-conductive bodies 41′, 42′. Each of the heat-conductive bodies 41′, 42′ is formed with an inner receiving space (not shown) in spatial communication with the fluid containing passage in the base unit 2 via a corresponding one of the openings 203, 209 in the base body 21 of the base unit 2 (see FIG. 5) such that the inner receiving space in each of the heat-conductive bodies 41′, 42′ permits flow of the heat exchanging fluid thereinto. It is noted that a slot is defined between an adjacent pair of the heat-dissipating fins 43′ and permits extension of a corresponding memory card 9 therethrough such that heat generated by the corresponding memory card 9 can be dissipated, as shown in FIG. 2.

As shown in FIG. 4, each driving unit 5 drives flow of the heat exchanging fluid in the fluid containing passage in the base unit 2, and includes a motor 51 and a fluid impeller 52. For each driving unit 5, the motor 51 is mounted on the mounting side 211 of the base body 21 of the base unit 2 and has a drive shaft (not shown) extending into the fluid containing passage in the base unit 2. The fluid impeller 52 is disposed in the fluid containing passage in the base unit 2, and is coupled to the drive shaft of the motor 51 such that the fluid impeller 52 is operable to rotate in response to operation of the motor 51, thereby driving flow of the heat exchanging fluid in the fluid containing passage in the base unit 2.

In sum, due to the presence of the heat sink devices 4, 4′, the fluid container 3, and the fluid containing passage contained with the heat exchanging fluid, the cooling system of the present invention can effectively dissipate heat generated by the computer device, thereby providing a superior cooling effect.

While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements. 

1. A cooling system for cooling a heat source, comprising: a base unit configured with a fluid containing passage therein and having a mounting side; a heat-conductive fluid container mounted on said mounting side of said base unit, formed with a fluid-receiving space therein in spatial communication with said fluid containing passage in said base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and a heat exchanging fluid contained in the fluid-receiving space in said fluid container and in said fluid containing passage in said base unit, said heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, said fluid vapor being capable of changing into fluid condensate when cooled.
 2. The cooling system as claimed in claim 1, further comprising at least one driving unit for driving flow of said heat exchanging fluid in said fluid containing passage in said base unit, said driving unit including a motor mounted on said mounting side of said base unit and having a drive shaft extending into said fluid containing passage in said base unit, and a fluid impeller disposed in said fluid containing passage in said base unit, and coupled to said drive shaft of said motor such that said fluid impeller is operable to rotate in response to operation of said motor, thereby driving flow of said heat exchanging fluid in said fluid containing passage in said base unit.
 3. The cooling system as claimed in claim 1, further comprising at least one heat sink device mounted on said base unit for dissipating the heat generated by the heat source.
 4. The cooling system as claimed in claim 3, wherein said heat sink device includes: two heat-conductive bodies mounted on said mounting side of said base unit, and spaced apart from each other, each of said heat-conductive bodies being formed with an inner receiving space in spatial communication with said fluid containing passage in said base unit such that said inner receiving space in each of said heat-conductive bodies permits flow of said heat exchanging fluid thereinto; and a plurality of heat-dissipating fins interconnecting said heat-conductive bodies.
 5. The cooling system as claimed in claim 4, wherein said heat sink device further includes a fan unit disposed between said heat-conductive bodies for cooling said heat-dissipating fins.
 6. The cooling system as claimed in claim 1, wherein said base unit includes: a base body having said mounting side, and a connecting side opposite to said mounting side and formed with a groove unit; and a cover body attached on said connecting side surface of said base body, and covering sealingly said groove unit such that said groove unit constitutes said fluid containing passage.
 7. The cooling system as claimed in claim 1, wherein said heat exchanging fluid includes water. 